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Intel® Xeon® Processor 5000 Series: CEK and PMM

Mechanical Model and Common Enabling Kit: Toolkit for modeling the Intel® Xeon® processor 5000 series mechanical characteristics. (v.002)

Intel® Xeon® Processor 5100 Series: Thermal Guide

Guide: Thermal solutions and design parameters for the dual-core Intel® Xeon® processor 5100 series that demonstrate processor cooling features.

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Intel® Xeon® Processor i3-2115 C: Power Guideline Addendum

Power Guideline Addendum: Provides power numbers on the Intel® Xeon® processor i3-2115 C while running real life applications. (v.001, Aug. 2012)

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Application Power Guideline for Intel® Embedded Processors

White Paper: Application Power Guidelines based on realistic power consumption estimates for Intel® Embedded processors. (v.001, Dec. 2010)

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Cave Creek PCH Icepak* Thermal Model and User’s Guide

User’s Guide: Icepak* thermal model for designers simulating, analyzing, and optimizing the Cave Creek Platform Controller Hub. (v.1.0, Jan. 2011)

Cave Creek PCH Flotherm* Thermal Model and User’s Guide

User’s Guide: Flotherm* thermal model for designers simulating, analyzing, and optimizing the Cave Creek Platform Controller Hub. (v.1.0, Jan. 2011)

Intel® Communications Chipset 89xx Series: Design Guide

Design Guide: Thermal and mechanical design specifications for the Intel® Communications Chipset 89xx Series. (v.001, Oct. 2012)

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Intel® Atom™ LEAP* Platform: Energy-Efficient Embedded Computing

Reiher and Kaiser, UCLA, discuss Intel® Atom™ LEAP* architecture and embedded systems instructions for energy efficiency.

PCB Stack-up Overview for Intel® Architecture Platforms

White Paper: PCB stack-up designs for Intel® Architecture platforms meet high-speed needs, addressing challenges with speed and costs. (Dec. 2008)

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Intel® C600 Series Chipset: Thermal Guide

Specifications, thermal and mechanical operating limits, and solutions for the Intel® C600 Series Chipset.

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