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Component Surface Mount Technology: Guide

Surface mount technology guide provides instructions and diagrams for more reliable assemblies, increasing density for less weight, volume, and cost.

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Electrostatic Discharge and Electrical Overstress: Guide

Document describes how electrostatic discharge and electrical overstress are caused, the damage they cause, and methods of prevention.

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Strain Measurement Methodology for Circuit Board Assembly: Guide

Guide: Explains how manufacturers can compare strain measurement results to the Intel strain guidance by creating a strain report.

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Electrostatic Discharge Detection: Antenna and Oscilloscope

Demos antenna and oscilloscope use for electrostatic discharge detection, including the minimum tool requirements and how to set up the parameters.

Chengdu Chipset Operation ISO 9001:2008 Certificate

Certifies that Chengdu Chipset Operation complies with ISO 9001:2008 requirements of semiconductor assembly and testing.

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Aloha Factory Operations ISO 9001:2008

Certifies that Aloha Factory Operations complies with the ISO 9001:2008 requirements of wafer fabrication, associated equipment, and processes.

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Intel Ireland Ltd. Fab 24 ISO 9001:2008

Certifies that Fab 24 in Leixlip, Ireland, complies with the ISO 9001:2008 requirements of wafer fabrication, associated equipment, and processes.

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Intel Mask Operations ISO 9001:2008

Certifies that Intel Mask Operations in Santa Clara complies with ISO 9001:2008 requirements of wafer fabrication, associated equipment, and more.

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FSM Multi-Site Registration, CMB ISO 9001:2008

Certifies the Fab/Sort Manufacturing multi-site registration complies with ISO 9001:2008 requirements.

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Fab 17 ISO 9001:2008

Certifies that Fab 17 in Hudson, Massachusetts, complies with the ISO 9001:2008 requirements of wafer fabrication, associated equipment, and more.

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