2 NG Intel Product Identification Codes 8 0 3 8 6 S X 1 6 S X 3 8 7 Up to15 Alphanumeric Characters For Device Types Package Type Up to 6 Alphanumeric Characters to Show Customer-Specific Requirements A B C D DP E F FP FW FV G GB GC K KA KD KU N NG P PA PD PE Q R S SB SM U X – – – – – – – – – – – – – – – – – – – – – – – – – – – – – – ... Ceramic Pin Grid Array Ceramic Land Grid Array Ceramic Dual In-Line Package Cerdip Dual In-Line Package Cerdip Dual In-Line Package, 300 MIL Thin Small Out-Line Package, Die Up Thin Small Out-Line Package, Die Down Plastic Flatpack Package Plastic Ball Grid Array Die Up 1.27 mm Solder Ball Pitch Plastic Pin Grid Array, Cavity Down, Staggered Pin Micro Ball Grid Array Single In-Line Leaded Memory Module HL-PBGA-Thermally Enhanced, Plastic Ball Grid Array Ceramic Pin Grid Array Ceramic Pin Grid Array, Dual Cavity, Die Down Plastic Quad Flatpack Package, Fine Pitch, Die Down Plastic Quad Flatpack Package, Fine Pitch, Die Up Plastic Leaded Chip Carrier Plastic Quad Flatpack, Fine Pitch, Die Down with Heat Spreader Plastic Dual In-Line Package Small Out-Line "Gull-Wing" Package Plastic Dual In-Line Package, 300 MIL Small Out-Line "J"-Lead Package Ceramic Quad Flatpack Package Ceramic Leadless Chip Carrier Quad Flatpack Package Shrink Quad Flatpack Package Single In-Line Leadless Memory Module Plastic Dual In-Line Package, Shrink Dip Unpackaged Devices A I L Q T _ _ _ _ _ Indicates automotive operating temperature range. Indicates industrial grade. Indicates extended operating temperature range (-40˚C to +85˚C) express product with 160 ± 8 hrs. dynamic burn-in. Indicates commercial temperature range (0˚C to +70˚C) express product with 160 ± 8 hrs. dynamic burn-in. Indicates extended temperature range (-40˚C to +85˚C) express product without burn-in. A5581-02 1999 Packaging Databook 2-1 Package / Module / PC Card Outlines and Dimensions 2.1 2.1.1 Ceramic Side Braze Dual In-line Package Symbol List for Ceramic Side Braze Dual In-Line Family Letter or Description of Dimensions Symbol α Angular spacing between minimum and maximum lead positions measured at the gauge plane A Distance from seating plane to highest point of body (lid) A Distance between seating plane and base plane 1 A Distance from base plane to highest point of body (lid) 2 A Base body thickness 3 B Width of terminal leads B Width of terminal lead shoulder which locates seating plane (standoff geometry optional) 1 C Thickness of terminal leads D Largest overall package dimension of length D A body length dimension, end lead center to end lead center 2 E Largest overall package width dimension outside of lead E Body width dimensions not including leads 1 e Linear spacing between centerlines of body standoffs (terminal leads) 1 e Linear spacing of true minimum lead position center line to center line A e Linear spacing between true lead position outside of lead to outside of lead B L Distance from seating plane to end of lead N The total number of potentially usable lead positions S Distance from true position centerline of No. 1 lead position to the extremity of the body S Distance from outer end lead edge positions to the extremity of the body 1 NOTES: 1. Controlling dimension: millimeter. 2. Dimension “e ” (“e”) is non-cumulative. 1 3. Seating plane (standoff) is defined Read the full Package / Module / PC Card Outlines and Dimensions.