Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide

Intel® Xeon® Processor 5500/5600 
Series Thermal/Mechanical Design Guide

Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide

March 2010 Reference Number: 321323-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL ...DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel® Xeon® processor 5500 series, 5600 series and LGA1366 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details. Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see www.intel.com. Intel, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries. * Other brands and names may be claimed as the property of others. Copyright © 2009, Intel Corporation. 2 Thermal/Mechanical Design Guide Contents 1 2 3 4 5 6 Introduction ..............................................................................................................9 1.1 References ....................................................................................................... 10 1.2 Definition of Terms ............................................................................................ 10 LGA1366 Socket ...................................................................................................... 13 2.1 Board Layout.................................................................................................... 15 2.2 Attachment to Motherboard ................................................................................ 16 2.3 Socket Components........................................................................................... 16 2.3.1 Socket Body Housing .............................................................................. 16 2.3.2 Solder Balls ........................................................................................... 16 2.3.3 Contacts ............................................................................................... 17 2.3.4 Pick and Place Cover............................................................................... 17 2.4 Package Installation / Removal ........................................................................... 18 2.4.1 Socket Standoffs and Package Seating Plane.............................................. 18 2.5 Durability......................................................................................................... 19 2.6 Markings.......................................................................................................... 19 2.7 Component Insertion Forces ............................................................................... 19 2.8 Socket Size ...................................................................................................... 19 2.9 LGA1366 Socket NCTF Solder Joints..................................................................... 20 Independent Loading Mechanism (ILM)................................................................... 21 3.1 Design Concept................................................................................................. 21 3.1.1 ILM Cover Assembly Design Overview ....................................................... 21 3.1.2 ILM Back Plate Design Overview............................................................... 22 Read the full Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide.

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