® ® Dual-Core Intel Xeon Processor 7000 Sequence Thermal/Mechanical Design Guidelines

® ® 
Dual-Core Intel Xeon 
Processor 7000 Sequence 
Thermal/Mechanical Design Guidelines

® ® Dual-Core Intel Xeon Processor 7000 Sequence Thermal/Mechanical Design Guidelines

November 2005 Document Number: 309625-001 ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES ...RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel may make changes to specifications, product descriptions, and plans at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Dual-Core Intel® Xeon® processor 7000 sequence may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel's website at http://www.intel.com. Intel, Pentium and Intel Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. * Other brands and names may be claimed as the property of others. Copyright © 2005, Intel Corporation. All rights reserved. 2 ® ® Dual-Core Intel Xeon Processor 7000 Sequence Thermal /Mechanical Guidelines Contents 1 2 A B C D Introduction.........................................................................................................................7 1.1 Objective ...............................................................................................................7 1.2 Scope ....................................................................................................................7 1.3 References............................................................................................................7 1.4 Definition of Terms ................................................................................................8 Thermal Mechanical Design.............................................................................................11 2.1 Mechanical Requirements...................................................................................11 2.1.1 Processor Mechanical Parameters ........................................................11 2.1.2 Mechanical Dimensions .........................................................................12 2.1.3 Mechanical Considerations ....................................................................14 2.2 Processor Thermal Parameters and Features ....................................................15 2.2.1 Thermal Control Circuit and TDP ...........................................................15 2.2.2 Dual Core Special Considerations .........................................................16 2.2.3 Thermal Profile .......................................................................................18 2.2.4 TCONTROL Definition............................................................................20 2.2.5 Performance Targets..............................................................................21 2.3 Characterizing Cooling Solution Performance Requirements .............................22 2.3.1 Fan Speed Control .................................................................................22 2.3.2 Processor Thermal Characterization Parameter Relationships..........................................................................................23 2.3.3 Chassis Thermal Design Considerations ...............................................25 2.4 Thermal/Mechanical Reference Design Considerations .....................................26 2.4.1 Heatsink Solutions..................................................................................26 2.4.2 Thermal Interface Material .....................................................................26 2.4.3 Summary................................................................................................27 2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design .................................................................................27 2.4.5 Thermal Solution Performance Characteristics......................................29 2.4.6 Thermal Profile Adherence.....................................................................31 2.4.7 Components Overview ...........................................................................32 Mechanical Drawings .......................................................................................................35 Safety Requirements........................................................................................................49 Quality and Reliability Requirements ...............................................................................51 C.1 Intel Verification Criteria for the Reference Designs ...........................................51 C.1.1 Reference Heatsink Thermal Verification...............................................51 C.1.2 Environmental Reliability Testing ...........................................................51 C.1.3 Material and Recycling Requirements....................................................53 Supplier Information .........................................................................................................55 D.1 Intel Enabled Suppliers .......................................................................................55 ® ® Dual-Core Intel Xeon Processor 7000 Sequence Thermal /Mechanical Guidelines 3 Figures 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 2-9 2-10 2-11 2-12 2-13 2-14 2-15 A-1 A-2 A-3 A-4 A-5 A-6 A-7 A-8 A-9 A-10 A-11 A-12 A-13 C-1 C-2 Dual-Core Intel® Xeon® Processor 7000 Sequence Mechanical Drawing, Sheet 1 .............................................................................12 Dual-Core Intel® Xeon® Read the full ® ® Dual-Core Intel Xeon Processor 7000 Sequence Thermal/Mechanical Design Guidelines.

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